Stability analysis of electroplating formulations using DataPhysics MS 20 dispersion stability analysis system
Resource type:
Application note
Format:
pdf
Date of creation:
2 January 2024
Library code:
13609
With the MultiScan 20 (MS 20) dispersion stability analysis system from DataPhysics stability changes can be detected and evaluated in a quantitative way much faster than any traditional shelflife test would permit.
In this application note, it is described how changes of the pH-value influence the stability of the liquid used for a copper electroplating bath.
